Künzell
Germany
13
2021-05-06
The entities that hold a legal rights for patent applications filed by inventor Schäfer Michael:
Michael Schäfer from Künzell, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PREFORM
#2 | 2021-04-15Method for producing a stable sandwich arrangement of two components with solder situated therebetween
#3 | 2020-05-21METHOD FOR CONNECTING COMPONENTS BY MEANS OF A METAL PASTE
#4 | 2020-05-14METHOD FOR CONNECTING COMPONENTS BY MEANS OF A METAL PASTE
#5 | 2018-11-01Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinter
#6 | 2018-10-04Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#7 | 2018-05-31Metal paste and use thereof for joining components
#8 | 2018-02-22Electrical feedthrough with a sintered electrical connection
#9 | 2017-08-03Method for producing a silver sintering agent having silver oxide surfaces and use of said agent in methods for joining components by pressure sintering
#10 | 2017-04-27Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
#11 | 2012-06-21Metal paste with co-precursors
#12 | 2012-06-21Metal paste with oxidizing agents
#13 | 2012-03-08Contacting means and method for contacting electrical components
2120809 ⎘