Gilbert, Arizona
United States
26
2025-10-30
The entities that hold a legal rights for patent applications filed by inventor ST. GERMAIN Stephen:
Stephen ST. GERMAIN from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#2 | 2025-10-16LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#3 | 2025-10-02LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#4 | 2024-08-29LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#5 | 2024-06-20LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#6 | 2024-06-20LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#7 | 2024-04-25STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
#8 | 2024-04-18LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#9 | 2023-10-05Semiconductor package structures and methods of manufacture
#10 | 2022-12-29Low stress asymmetric dual side module
#11 | 2022-12-29Low stress asymmetric dual side module
#12 | 2022-12-29Low stress asymmetric dual side module
#13 | 2022-12-29Low stress asymmetric dual side module
#14 | 2022-08-18Semiconductor device and method for supporting ultra-thin semiconductor die
#15 | 2022-06-30Structure and method related to a power module using a hybrid spacer
#16 | 2022-06-02Reducing stress cracks in substrates
#17 | 2022-03-17Semiconductor package structures and methods of manufacture
#18 | 2021-08-12Structure and method related to a power module using a hybrid spacer
#19 | 2021-02-04Low stress asymmetric dual side module
#20 | 2021-02-04Low stress asymmetric dual side module
#21 | 2020-08-13Semiconductor device and method for supporting ultra-thin semiconductor die
#22 | 2020-05-28Packaging structure for gallium nitride devices
#23 | 2019-12-19Semiconductor package structures and methods of manufacture
#24 | 2019-01-31Semiconductor device and method for supporting ultra-thin semiconductor die
#25 | 2018-09-06Semiconductor device and method for supporting ultra-thin semiconductor die
#26 | 2018-02-22Holes and dimples to control solder flow
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