Phoenix, Arizona
United States
10
2026-02-05
The entities that hold a legal rights for patent applications filed by inventor RAMPLEY Colby Greg:
Colby Greg RAMPLEY from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
WAFER WITH SEMICONDUCTOR DEVICES AND INTEGRATED ELECTRONIC DISCHARGE PROTECTION
#2 | 2025-01-02TRANSISTORS WITH DIELECTRIC SPACERS AND METHODS OF FABRICATION THEREOF
#3 | 2025-01-02TRANSISTORS WITH RECESSED FIELD PLATES AND METHODS OF FABRICATION THEREOF
#4 | 2022-12-08WAFER WITH SEMICONDUCTOR DEVICES AND INTEGRATED ELECTROSTATIC DISCHARGE PROTECTION
#5 | 2021-02-04Low drain-source on resistance semiconductor component and method of fabrication
#6 | 2020-12-17Method for increasing semiconductor device wafer strength
#7 | 2020-10-22Packaged dies with metal outer layers extending from die back sides toward die front sides
#8 | 2019-01-10Method of wafer dicing for wafers with backside metallization and packaged dies
#9 | 2018-11-01Method for making an electronic component package
#10 | 2018-03-01ALUMINUM NITRIDE PROTECTION OF SILVER APPARATUS, SYSTEM AND METHOD
2129104 ⎘