Derek William Meyer

City:

Truckee, California

Country:

United States

Published Applications:

Last publication date:

2019-05-09

Top Assignees for applications by Derek William Meyer

The entities that hold a legal rights for patent applications filed by inventor Meyer Derek William:

Wave Computing, Inc. 1 Campbell, CA United States

Recent patent applications by Meyer Derek William

Derek William Meyer from Truckee, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-05-09

US20190138373A1

Physics

MULTITHREADED DATA FLOW PROCESSING WITHIN A RECONFIGURABLE FABRIC

#2 | 2019-02-07

US20190042918A1

Physics

REMOTE USAGE OF MACHINE LEARNED LAYERS BY A SECOND MACHINE LEARNING CONSTRUCT

#3 | 2018-03-01

US20180060034A1

Physics

Communication between dataflow processing units and memories

InventorID:

2129608 ⎘