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Inventor profile of:

Benjamin LINDSTROM

City:

Lansing, Michigan

Country:

United States

Published Applications:

1

Last publication date:

2018-03-15

Recent patent applications by LINDSTROM Benjamin

Benjamin LINDSTROM from Lansing, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-03-15

US20180073672A1

Mechanical engineering

MACHINERY ASSEMBLY WITH MODULAR SKID

InventorID:

2140414 ⎘