Jun H. Bae

City:

Medfield, Massachusetts

Country:

United States

Published Applications:

Last publication date:

2019-12-05

Top Assignees for applications by Jun H. Bae

The entities that hold a legal rights for patent applications filed by inventor Bae Jun H.:

Jun H. Bae from Medfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Overmolded lead frame assembly for pressure sensing applications

Integrated pressure and temperature sensor

InventorID:

2140676 ⎘