Hsinchu
Taiwan
16
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor Chen Yang-Che:
Yang-Che Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#2 | 2026-03-19SEMICONDUCTOR DEVICE AND BONDING FAILURE TEST METHOD THEREOF
#3 | 2026-01-22GALVANIC EFFECT MONITOR TEST STRUCTURE FOR IC PACKAGE INTERPOSER
#4 | 2025-07-24SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND METHODS OF FORMING SAME
#5 | 2025-03-13SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME
#6 | 2022-12-01Semiconductor package and method for making the same
#7 | 2022-11-17Semiconductor device with enhanced thermal dissipation and method for making the same
#8 | 2022-06-23Dual micro-electro mechanical system and manufacturing method thereof
#9 | 2021-07-01Semiconductor package and method for making the same
#10 | 2021-05-06Dual micro-electro mechanical system and manufacturing method thereof
#11 | 2020-04-30Semiconductor device with enhanced thermal dissipation and method for making the same
#12 | 2020-04-16Semiconductor packages having dummy connectors and methods of forming same
#13 | 2019-10-31Method of detecting delamination in an integrated circuit package structure
#14 | 2019-04-18Semiconductor packages having dummy connectors and methods of forming same
#15 | 2018-03-15Semiconductor packages having dummy connectors and methods of forming same
#16 | 2015-05-21Mechanisms for forming micro-electro mechanical device
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