Daisuke HIMETA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-01-30

Top Assignees for applications by Daisuke HIMETA

The entities that hold a legal rights for patent applications filed by inventor HIMETA Daisuke:

Daisuke HIMETA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

MULTILAYER CAPACITOR

Multilayer capacitor having sintered electrode layer with wraparound portion

Feedthrough capacitor

Electronic component having depression on surface

Electronic component

InventorID:

2147761 ⎘