Inventor profile of:

Lars TEBJE

City:

Reutlingen

Country:

Germany

Published Applications:

27

Last publication date:

2022-10-13

Top Assignees for applications by Lars TEBJE

The entities that hold a legal rights for patent applications filed by inventor TEBJE Lars:

Recent patent applications by TEBJE Lars

Lars TEBJE from Reutlingen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-10-13
US20220326105A1
Physics

Micromechanical component for a pressure and inertial sensor device

#2 | 2022-03-24
US20220091154A1
Physics

Micromechanical structure and micromechanical sensor

#3 | 2022-03-03
US20220063990A1
Performing operations; transporting

Micromechanical sensor device and corresponding production method

#4 | 2022-02-17
US20220049958A1
Physics

Micromechanical system, method for operating a micromechanical system

#5 | 2020-07-30
US20200241035A1
Physics

Micromechanical inertial sensor

#6 | 2019-12-19
US20190383852A1
Physics

Method for operating a micromechanical inertial sensor

#7 | 2017-03-23
US20170081177A1
Performing operations; transporting

INTERPOSER FOR MOUNTING A VERTICALLY INTEGRATED HYBRID COMPONENT ON A COMPONENT CARRIER

#8 | 2017-03-02
US20170059321A1
Physics

Method for manufacturing a MEMS element

#9 | 2015-12-10
US20150355217A1
Physics

Micromechanical acceleration sensor

#10 | 2015-12-10
US20150353346A1
Performing operations; transporting

Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component

#11 | 2015-12-10
US20150353345A1
Performing operations; transporting

Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling Structure

#12 | 2015-02-26
US20150053000A1
Physics

Micromechanical sensor

#13 | 2014-01-23
US20140021515A1
Performing operations; transporting

Micromechanical structure, in particular sensor arrangement, and corresponding operating method

#14 | 2013-11-14
US20130299927A1
Performing operations; transporting

Hybrid intergrated component and method for the manufacture thereof

#15 | 2013-05-02
US20130104654A1
Physics

Micromechanical component and method for manufacturing a micromechanical component

#16 | 2012-11-29
US20120297879A1
Physics

Inertial sensor with overlapping torsional springs

#17 | 2011-09-22
US20110226059A1
Physics

SENSOR AND METHOD FOR MANUFACTURING A SENSOR

#18 | 2011-08-18
US20110197678A1
Physics

Acceleration sensor having an electrode bridge

#19 | 2011-06-30
US20110154899A1
Physics

Micromechanical component and method for operating a micromechanical component

#20 | 2010-08-19
US20100206072A1
Physics

MICROMECHANICAL COMPONENT AND METHOD FOR OPERATING A MICROMECHANICAL COMPONENT

#21 | 2010-05-06
US20100107762A1
Physics

Acceleration sensor and method for its manufacture

#22 | 2010-02-25
US20100043549A1
Physics

Triaxial acceleration sensor

#23 | 2010-02-04
US20100024554A1
Physics

Triaxial acceleration sensor

#24 | 2010-02-04
US20100024553A1
Physics

Micromechanical z-sensor

#25 | 2009-12-24
US20090314085A1
Physics

Micromechanical acceleration sensor having an open seismic mass

#26 | 2009-06-18
US20090152654A1
Physics

Micromechanical system including a suspension and an electrode positioned movably

#27 | 2008-06-19
US20080141774A1
Physics

Acceleration sensor

InventorID:

215263 ⎘