Poughkeepsie, New York
United States
44
2019-04-11
The entities that hold a legal rights for patent applications filed by inventor McKEEVER Eric J.:
Eric J. McKEEVER from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Customized module lid
#2 | 2018-12-20Coupling assemblies for connecting fluid-carrying components
#3 | 2018-12-20Coupling assemblies for connecting fluid-carrying components
#4 | 2016-12-15Tapering couplers for connecting fluid flow components
#5 | 2016-11-24Coupling assemblies for connecting fluid-carrying components
#6 | 2016-11-24Coupling assemblies for connecting fluid-carrying components
#7 | 2016-10-06Flexible coolant manifold—heat sink assembly
#8 | 2016-09-27Pluggable module for heat removal device
#9 | 2016-08-18Flexible coolant manifold-heat sink assembly
#10 | 2016-08-04Integrated parallel optical transceiver
#11 | 2016-08-04INTEGRATED PARALLEL OPTICAL TRANSCEIVER
#12 | 2016-08-04Optical fiber routing mat
#13 | 2016-08-04Optical fiber routing mat
#14 | 2016-08-04Blind mating strain relieved optical fiber connector
#15 | 2016-08-04Blind mating strain relieved optical fiber connector
#16 | 2016-06-16Customized module lid
#17 | 2016-06-02Customized module lid
#18 | 2016-06-02Tapering couplers for connecting fluid flow components
#19 | 2016-03-17Compute intensive module packaging
#20 | 2016-03-17Compute intensive module packaging
#21 | 2016-02-18Multi-component electronic module with integral coolant-cooling
#22 | 2016-02-11System for inserting and removing cables
#23 | 2015-12-10Selective clamping of electronics card to coolant-cooled structure
#24 | 2015-03-19Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly
#25 | 2015-02-26Fabricating multi-component electronic module with integral coolant-cooling
#26 | 2015-02-26Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
#27 | 2015-02-26Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)
#28 | 2015-02-26Selective clamping of electronics card to coolant-cooled structure
#29 | 2015-02-19Methods of fabricating a coolant-cooled electronic assembly
#30 | 2015-01-22Method for inserting and removing cables
#31 | 2014-10-16Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly
#32 | 2014-09-11Multi-component electronic module with integral coolant-cooling
#33 | 2014-09-11System for inserting and removing cables
#34 | 2014-09-04Selective clamping of electronics card to coolant-cooled structure
#35 | 2014-09-04Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
#36 | 2014-08-28Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)
#37 | 2014-08-28Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)
#38 | 2013-06-04Rolling cabinet support system
#39 | 2013-05-02Coolant manifold with separately rotatable manifold section(s)
#40 | 2013-05-02Coolant manifold with separately rotatable manifold section(s)
#41 | 2012-08-30Logic node connection system
#42 | 2012-08-30Shared system to operationally connect logic nodes
#43 | 2012-08-30System to operationally connect logic nodes
#44 | 2012-08-30Electronic assemblies mating system
216126 ⎘