Heinz Euchner

City:

Birkenfeld

Country:

Germany

Published Applications:

Last publication date:

2018-04-12

Top Assignees for applications by Heinz Euchner

The entities that hold a legal rights for patent applications filed by inventor Euchner Heinz:

Heinz Euchner from Birkenfeld, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Subrack assembly for electronic equipment

Module frame for receiving electronic plug-in modules

Device for levering in and levering out a plug-in unit

InventorID:

2164048 ⎘