Austin, Texas
United States
11
2024-09-26
The entities that hold a legal rights for patent applications filed by inventor TANG Junyan:
Junyan TANG from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION TO CABLE INTERCONNECT
#2 | 2024-07-11DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
#3 | 2024-04-25Dense via pitch interconnect to increase wiring density
#4 | 2023-12-28ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT
#5 | 2021-04-15PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication
#6 | 2021-04-15Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)
#7 | 2020-04-09Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures
#8 | 2018-04-26Reduction of crosstalk between dielectric waveguides using split ring resonators
#9 | 2018-04-26Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes
#10 | 2018-04-26Neural Network Based Prediction of PCB Glass Weave Induced Skew
#11 | 2018-04-19Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
2168599 ⎘