Bucheon-si
South Korea
8
2024-07-11
The entities that hold a legal rights for patent applications filed by inventor IM Seungwon:
Seungwon IM from Bucheon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
#2 | 2022-03-24Integrated circuit direct cooling systems having substrates in contact with a cooling medium
#3 | 2020-06-18Semiconductor die package including a one-body clip
#4 | 2020-06-11Semiconductor package having a spacer with a junction cooling pipe
#5 | 2019-04-25Package including multiple semiconductor devices
#6 | 2018-11-01Semiconductor package having junction cooling pipes embedded in substrates
#7 | 2018-05-03Semiconductor die package and manufacturing method
#8 | 2014-09-18Power module having stacked flip-chip and method for fabricating the power module
2180459 ⎘