Beppu
Japan
7
2024-01-04
The entities that hold a legal rights for patent applications filed by inventor Ando Takafumi:
Takafumi Ando from Beppu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
#2 | 2023-01-19Method of manufacturing transformers with laminate windings and build-up films
#3 | 2023-01-19INTEGRATED CIRCUIT
#4 | 2022-08-04CONDUCTIVE PATTERNING USING A PERMANENT RESIST
#5 | 2021-11-04Integrated circuit
#6 | 2021-03-25Transformers with build-up films
#7 | 2018-05-03PLATED DITCH PRE-MOLD LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD OF MAKING SAME
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