Dublin, California
United States
23
2024-02-01
The entities that hold a legal rights for patent applications filed by inventor Geiger David:
David Geiger from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
#2 | 2023-03-23PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS
#3 | 2023-03-02ADJUSTABLE CARRIER WITH CHANGEABLE CORE AND METHODS FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLIES
#4 | 2022-10-13Methods of creating exposed cavities in molded electronic devices
#5 | 2021-04-01Methods of creating exposed cavities in molded electronic devices
#6 | 2020-06-11Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components
#7 | 2020-06-11PRINTED PARTS WITH INTERLAYERS AND METHODS OF MANUFACTURING THE SAME
#8 | 2020-06-11WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING
#9 | 2020-06-11Wave solder pallets for optimal solder flow and methods of manufacturing
#10 | 2019-03-12Copper interconnect for PTH components assembly
#11 | 2018-05-10Adjustable carrier with changeable core
#12 | 2018-05-10Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components
#13 | 2018-05-10Method of manufacturing a part
#14 | 2018-05-10Method of manufacturing a wave solder pallet
#15 | 2017-10-24Bellows interconnect
#16 | 2017-07-04Printed circuit board made through sintering copper nano-particles
#17 | 2017-05-23Method of and device for quality control process optimization
#18 | 2017-05-23Nano-copper pillar interconnects and methods thereof
#19 | 2017-03-28Graphite sheet to redirect SMT components during thermal exposure
#20 | 2017-02-14Fast cure conductive epoxy attach methodology for high speed automated processes
#21 | 2016-12-13Graphite sheet to protect SMT components from thermal exposure
#22 | 2016-07-19Fixture design for pre-attachment package on package component assembly
#23 | 2012-12-11PV cell mass reflow
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