Inventor profile of:

Taeho Kook

City:

Orlando, Florida

Country:

United States

Published Applications:

17

Last publication date:

2018-02-08

Top Assignees for applications by Taeho Kook

The entities that hold a legal rights for patent applications filed by inventor Kook Taeho:

Recent patent applications by Kook Taeho

Taeho Kook from Orlando, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-02-08
US20180041193A1
Electricity

Acoustic filtering circuitry including capacitor

#2 | 2013-05-02
US20130106535A1
Electricity

High coupling, low loss saw filter and associated method

#3 | 2012-06-28
US20120161577A1
Electricity

Acoustic wave guide device and method for minimizing trimming effects and piston mode instabilities

#4 | 2012-03-29
US20120077323A1
Electricity

Semiconductor device and process for reducing damaging breakdown in gate dielectrics

#5 | 2011-10-11
US12398711
-

Bonded wafer SAW filters and methods

#6 | 2011-08-25
US20110204747A1
Electricity

Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor

#7 | 2011-05-10
US12256494
-

Acoustic wave device employing reflective elements for confining elastic energy

#8 | 2010-02-25
US20100045326A1
Physics

Thermal monitoring and management of integrated circuits

#9 | 2009-03-19
US20090072393A1
Electricity

Structure and method for fabricating flip chip devices

#10 | 2008-01-31
US20080026508A1
Electricity

Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink

#11 | 2007-12-20
US20070290278A1
Electricity

Semiconductor device and process for reducing damaging breakdown in gate dielectrics

#12 | 2007-03-29
US20070069368A1
Electricity

Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink

#13 | 2007-03-29
US20070069365A1
Physics

Semiconductor with damage detection circuitry

#14 | 2007-03-22
US20070063352A1
Electricity

Routing under bond pad for the replacement of an interconnect layer

#15 | 2006-10-12
US20060226535A1
Electricity

Reinforced bond pad for a semiconductor device

#16 | 2006-03-30
US20060066327A1
Electricity

Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process

#17 | 2006-03-30
US20060065969A1
Electricity

Reinforced bond pad for a semiconductor device

InventorID:

218655 ⎘