Cheng-Ping LIN

City:

Hsinchu County

Country:

Taiwan

Published Applications:

Last publication date:

2023-03-30

Top Assignees for applications by Cheng-Ping LIN

The entities that hold a legal rights for patent applications filed by inventor LIN Cheng-Ping:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 3 Hsinchu, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 2 Hsinchu, Taiwan

Recent patent applications by LIN Cheng-Ping

Cheng-Ping LIN from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-30

US20230098830A1

Electricity

Method for manufacturing package structure

#2 | 2021-04-01

US20210098384A1

Electricity

Package structure

#3 | 2020-05-14

US20200152576A1

Electricity

Method for manufacturing package structure

#4 | 2018-10-25

US20180308800A1

Electricity

Package structure and method for forming the same

#5 | 2018-05-10

US20180130749A1

Electricity

Package structure and method for forming the same

InventorID:

2186780 ⎘