Hsinchu
Taiwan
58
2026-03-05
The entities that hold a legal rights for patent applications filed by inventor Wang Pu:
Pu Wang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE AND METHOD
#2 | 2025-11-06CHIP PACKAGE STRUCTURE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME
#3 | 2025-10-02HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#4 | 2025-10-02INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#5 | 2025-06-26CHIP PACKAGE STRUCTURE WITH ring structure AND METHOD FOR FORMING THE SAME
#6 | 2025-06-26COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
#7 | 2025-03-27Integrated Circuit Packages and Methods of Forming the Same
#8 | 2024-11-28SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
#9 | 2024-11-07HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM
#10 | 2024-11-07PACKAGE STRUCTURES
#11 | 2024-08-08PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#12 | 2024-03-14SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#13 | 2024-02-29SEMICONDUCTOR PACKAGE AND METHOD
#14 | 2024-02-01Integrated Circuit Packages and Methods of Forming the Same
#15 | 2024-01-11Coplanar control for film-type thermal interface
#16 | 2023-11-23Semiconductor structure and method of forming the same
#17 | 2023-11-23MULTI-TIM PACKAGES AND METHOD FORMING SAME
#18 | 2023-11-23INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#19 | 2023-11-16Manufacturing method of semiconductor package using jig
#20 | 2023-10-05High efficiency heat dissipation using thermal interface material film
#21 | 2023-09-14Package structure with metallic layer over the surfaces of a plurality of semiconductor dies
#22 | 2023-03-23Dummy die placement without backside chipping
#23 | 2023-03-09Package structure and method of manufacturing the same
#24 | 2023-03-02Package structure and manufacturing method thereof
#25 | 2023-02-16Package structure and manufacturing method thereof
#26 | 2023-01-26Semiconductor package and manufacturing method thereof
#27 | 2023-01-19SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#28 | 2023-01-19PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING AN INNER FOOT AND METHODS OF MAKING THE SAME
#29 | 2023-01-19Heat Dissipation Structures for Integrated Circuit Packages and Methods of Forming the Same
#30 | 2022-12-08High efficiency heat dissipation using thermal interface material film
#31 | 2022-12-01Semiconductor devices and methods of manufacture
#32 | 2022-11-17Package structure and method of fabricating the same
#33 | 2022-11-10Package structure and method of fabricating the same
#34 | 2022-11-10Coplanar control for film-type thermal interface
#35 | 2022-11-10Multi-TIM Packages and Method Forming Same
#36 | 2022-10-27Semiconductor structure and method of forming the same
#37 | 2022-07-21Manufacturing method of semiconductor package using jig
#38 | 2022-05-19Package structures
#39 | 2022-04-21Semiconductor devices and methods of manufacture
#40 | 2022-04-21Package structure and method of manufacturing the same
#41 | 2021-07-15Semiconductor device and manufacturing method of the same
#42 | 2021-07-01Package structure and method of fabricating the same
#43 | 2021-04-22Dummy die placement without backside chipping
#44 | 2021-04-01Package structure and manufacturing method thereof
#45 | 2020-11-19Dummy die placement without backside chipping
#46 | 2020-10-22Semiconductor package structure and method for forming the same
#47 | 2020-05-14Semiconductor device and manufacturing method of the same
#48 | 2020-03-19Semiconductor package
#49 | 2020-01-02Semiconductor device and method of manufacture
#50 | 2019-09-12Semiconductor device and manufacturing method of the same
#51 | 2019-05-16Semiconductor device and method of manufacture
#52 | 2019-04-11Package structures and methods of forming the same
#53 | 2019-04-04PoP device and method of forming the same
#54 | 2019-03-28Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly
#55 | 2019-03-28Package of integrated circuits having a light-to-heat-conversion coating material
#56 | 2019-01-03Method of manufacturing a release film as isolation film in package
#57 | 2018-05-17Package structures and methods of forming the same
#58 | 2018-04-19Semiconductor device and manufacturing method of the same
2192991 ⎘