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Inventor profile of:

Holger KOCKSCH

City:

Hockenheim

Country:

Germany

Published Applications:

1

Last publication date:

2018-05-24

Recent patent applications by KOCKSCH Holger

Holger KOCKSCH from Hockenheim, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-05-24

US20180141692A1

Performing operations; transporting

LID ASSEMBLY FOR A PACKING CONTAINER, PACKING CONTAINER WITH SUCH A LID ASSEMBLY, AND METHOD FOR MANUFACTURING SAME

InventorID:

2195694 ⎘