Leutenbach
Germany
24
2021-08-05
The entities that hold a legal rights for patent applications filed by inventor Graf Michael:
Michael Graf from Leutenbach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Protective circuit against electrostatic discharges
#2 | 2018-05-24Device and method for detecting a number of electrostatic discharges
#3 | 2011-10-27Low leakage FINFETs
#4 | 2009-11-05Method and system for incorporating high voltage devices in an EEPROM
#5 | 2009-10-15Semiconductor array and method for manufacturing a semiconductor array
#6 | 2008-11-27DMOS DEVICE WITH SEALED CHANNEL PROCESSING
#7 | 2008-11-13Electrostatic discharge (ESD) protection structure and a circuit using the same
#8 | 2007-12-20Method for producing a semiconductor arrangement, semiconductor arrangement and its application
#9 | 2007-11-15Method for producing deep trench structures
#10 | 2007-11-15High-voltage field-effect transistor
#11 | 2007-10-11Lateral DMOS transistor and method for the production thereof
#12 | 2007-10-04Method and manufacturing low leakage MOSFETs and FinFETs
#13 | 2007-09-27DMOS device with sealed channel processing
#14 | 2007-09-06REGISTRATION MARK WITHIN AN OVERLAP OF DOPANT REGIONS
#15 | 2007-07-19Semiconductor array and method for manufacturing a semiconductor array
#16 | 2007-06-14DMOS transistor with optimized periphery structure
#17 | 2007-05-31Electrostatic discharge (ESD) protection structure and a circuit using the same
#18 | 2007-04-26Method and system for incorporating high voltage devices in an EEPROM
#19 | 2007-03-01Registration mark within an overlap of dopant regions
#20 | 2006-12-14Method for manufacturing a metal-semiconductor contact in semiconductor components
#21 | 2006-12-14Integrated circuit and method for manufacturing an integrated circuit
#22 | 2006-10-05ESD protection circuit with scalable current capacity and voltage capacity
#23 | 2005-08-04Method of producing active semiconductor layers of different thicknesses in an SOI wafer
#24 | 2005-08-04Process for manufacturing vertically insulated structural components on SOI material of various thickness
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