Ercan Dede

CORE-SHELL NANOPARTICLE HAVING A NITROGEN-VACANCY NANODIAMOND CORE SURROUNDED BY AN UPCONVERSION NANOPARTICLE SHELL FOR ENHANCED QUANTUM SENSING AND LASER COOLING

IN-MOLD COIL REPEATER ASSEMBLY FOR MOBILE DEVICE CASE

FLUIDIC OSCILLATORS FOR THE PASSIVE COOLING OF ELECTRONIC DEVICES

AIRFOIL FINS FOR THE PASSIVE COOLING OF ELECTRONIC DEVICES

SYSTEMS AND METHODS FOR COOLING AN ELECTRIC CHARGING CABLE

AUTONOMOUS VEHICLE FEEDBACK SYSTEM AND METHOD OF OPERATING AN AUTONOMOUS VEHICLE

3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS

CLOSED-LOOP REAL TIME SSVEP-BASED HEADS-UP DISPLAY TO CONTROL IN VEHICLE FEATURES USING DEEP LEARNING

CHANNEL WIDTH CONTROL FOR MULTI-ZONE MICROREACTOR FLOW FIELDS

FUEL CELL BIPOLAR PLATE DESIGN FOR REDUCED CORROSION POTENTIAL

Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same

Power electronics assemblies and methods of fabricating the same

Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures

3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards

Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same

Volumetric accessing of a volumetric display

Systems and methods for additive manufacturing of wick structure for vapor chamber

Functionally graded thermal vias for inductor winding heat flow control

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF WICK STRUCTURE FOR VAPOR CHAMBER

Electronics assemblies incorporating three-dimensional heat flow structures

Electronic assemblies having a cooling chip layer with impingement channels and through substrate vias

Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias