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Inventor profile of:

Wi Heon Kim

City:

Suwon

Country:

Korea (South)

Published Applications:

Last publication date:

2014-11-27

Top Assignees for applications by Wi Heon Kim

The entities that hold a legal rights for patent applications filed by inventor Kim Wi Heon:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 13 Suwon, Korea (South)
SAMSUNG ELECTRO-MECHANICS CO., LTD. 7 Suwon-si, Gyeonggi-do, Korea (South)
SAMSUNG ELECTRO-MECHANICS CO., LTD. 3 Gyunggi-do, Korea (South)
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon Gyunggi-do, Korea (South)
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon-si, Korea (South)

Recent patent applications by Kim Wi Heon

Wi Heon Kim from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-11-27

US20140345925A1

Electricity

Multilayer ceramic capacitor and mounting board therefor

#2 | 2014-11-06

US20140326493A1

Electricity

Multilayer ceramic electronic component and board for mounting the same

#3 | 2014-10-30

US20140318845A1

Electricity

Multilayer ceramic electronic component and board for mounting the same

#4 | 2014-10-30

US20140318844A1

Electricity

Multilayer ceramic electronic component and mounting board therefor

#5 | 2014-10-23

US20140311783A1

Electricity

Multilayer ceramic electronic component and board for mounting the same

#6 | 2014-10-16

US20140307362A1

Electricity

Multilayer ceramic electronic component and mounting board therefor

#7 | 2014-06-12

US20140160620A1

Electricity

Multilayer ceramic electronic component capable of reducing acoustic noise generated therein

#8 | 2014-06-12

US20140160619A1

Electricity

Multilayer ceramic electronic component including electrode lead out portions having different lengths

#9 | 2014-05-29

US20140146436A1

Electricity

Multilayer ceramic electronic component

#10 | 2014-05-08

US20140126104A1

Electricity

Multilayered ceramic electronic component and manufacturing method thereof

#11 | 2013-11-21

US20130308246A1

Electricity

Multilayered ceramic electronic component and fabrication method thereof

#12 | 2013-09-05

US20130229749A1

Electricity

Multilayer ceramic electronic component and method of manufacturing the same

#13 | 2013-05-30

US20130135789A1

Electricity

Multilayer ceramic electronic part

#14 | 2013-05-02

US20130107422A1

Electricity

Multilayered ceramic electronic component and fabrication method thereof

InventorID:

219963 ⎘