CHEE CAN LEE

City:

Bayan Lepas

Country:

Malaysia

Published Applications:

Last publication date:

2021-06-24

Top Assignees for applications by CHEE CAN LEE

The entities that hold a legal rights for patent applications filed by inventor LEE CHEE CAN:

CHEE CAN LEE from Bayan Lepas, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit substrate having a recess for receiving a solder fillet

INTEGRATED CIRCUIT PACKAGE HAVING PIN-UP INTERCONNECT

Integrated circuit substrate and method of producing thereof

Integrated circuit package having pin up interconnect

Single layer integrated circuit package

InventorID:

2204011 ⎘