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Inventor profile of:

Woonjae Beak

City:

Incheon

Country:

South Korea

Published Applications:

6

Last publication date:

2023-12-14

Top Assignees for applications by Woonjae Beak

The entities that hold a legal rights for patent applications filed by inventor Beak Woonjae:

  • STATS ChipPAC Pte Ltd. 6 Singapore, Singapore

Recent patent applications by Beak Woonjae

Woonjae Beak from Incheon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-12-14
US20230402383A1
Electricity

Semiconductor Device and Method of Providing High Density Component Spacing

#2 | 2021-09-30
US20210305168A1
Electricity

Semiconductor device and method of providing high density component spacing

#3 | 2020-12-24
US20200402817A1
Electricity

Semiconductor device and method of forming SIP module over film layer

#4 | 2020-09-10
US20200286835A1
Electricity

Semiconductor device and method of forming an integrated SiP module with embedded inductor or package

#5 | 2018-09-20
US20180269195A1
Electricity

Method of forming SIP module over film layer

#6 | 2018-06-07
US20180158779A1
Electricity

Semiconductor device and method of forming an integrated SIP module with embedded inductor or package

InventorID:

2209974 ⎘

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