Wuhan
China
74
2025-08-07
The entities that hold a legal rights for patent applications filed by inventor CHEN Jun:
Jun CHEN from Wuhan, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
TRAILER HITCH AND VEHICLE
#2 | 2025-04-10EMBEDDED PAD STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATION METHODS THEREOF
#3 | 2025-01-23STAIRCASE STRUCTURE FOR MEMORY DEVICE
#4 | 2025-01-16HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
#5 | 2024-09-19SCANNING CABINS, METHODS FOR IDENTIFYING SCANNING CABINS, AND IMAGING SYSTEMS
#6 | 2024-08-29THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#7 | 2023-12-28THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#8 | 2023-11-09Hybrid bonding contact structure of three-dimensional memory device
#9 | 2023-06-08FULL-SCREEN DISPLAY DEVICE
#10 | 2023-05-25Organic light-emitting diode display panel
#11 | 2023-03-23Hybrid bonding contact structure of three-dimensional memory device
#12 | 2023-03-16Staircase structure for memory device
#13 | 2023-03-16Staircase structure for memory device
#14 | 2022-12-29LIGHT SOURCE MODULE, OPTICAL COMMUNICATIONS BOARD, AND OPTICAL COMMUNICATIONS SYSTEM
#15 | 2022-07-28Method for forming channel hole plug of three-dimensional memory device
#16 | 2022-07-12Hot repair material of refractory materials
#17 | 2022-06-30Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#18 | 2022-04-14Display module and display device
#19 | 2021-12-23Memory cell structure of a three-dimensional memory device
#20 | 2021-11-04TOUCH DISPLAY APPARATUS AND METHOD FOR MANUFACTURING SAME
#21 | 2021-09-23Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer
#22 | 2021-09-16DWDM remote pumping system capable of improving OSNR
#23 | 2021-09-02Three-dimensional memory device having a shielding layer and method for forming the same
#24 | 2021-08-26EMBEDDED PAD STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES
#25 | 2021-05-06Hybrid bonding contact structure of three-dimensional memory device
#26 | 2021-05-06Embedded pad structures of three-dimensional memory devices and fabrication methods thereof
#27 | 2021-04-22Three-Dimensional Memory Devices and Fabricating Methods Thereof
#28 | 2021-04-22Memory device and forming method thereof
#29 | 2021-04-08Three-dimensional memory device having a shielding layer and method for forming the same
#30 | 2021-04-08Memory device and forming method thereof
#31 | 2021-04-01Pixel arrangement structure
#32 | 2021-04-01Three-dimensional memory devices and methods for forming the same
#33 | 2021-04-01Memory device and forming method thereof
#34 | 2021-02-04Hybrid bonding using dummy bonding contacts
#35 | 2021-01-07Memory cell structure of a three-dimensional memory device
#36 | 2021-01-07Source structure of three-dimensional memory device and method for forming the same
#37 | 2020-12-31Three-dimensional memory devices and fabricating methods thereof
#38 | 2020-12-03Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
#39 | 2020-12-03Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#40 | 2020-10-22Hybrid bonding using dummy bonding contacts and dummy interconnects
#41 | 2020-09-17Hybrid bonding contact structure of three-dimensional memory device
#42 | 2020-09-17Staircase structure for memory device
#43 | 2020-08-20Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#44 | 2020-08-13Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
#45 | 2020-08-13Word line contact structure for three-dimensional memory devices and fabrication methods thereof
#46 | 2020-07-30Memory cell structure of a three-dimensional memory device
#47 | 2020-07-30Hybrid bonding using dummy bonding contacts
#48 | 2020-07-30Hybrid bonding using dummy bonding contacts and dummy interconnects
#49 | 2020-05-14Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#50 | 2020-02-20Embedded pad structures of three-dimensional memory devices and fabrication methods thereof
#51 | 2020-01-30Memory structure and method for forming the same
#52 | 2020-01-23Methods for forming three-dimensional memory devices
#53 | 2020-01-23Three-dimensional memory devices
#54 | 2020-01-02Three-dimensional memory device having a shielding layer and method for forming the same
#55 | 2019-12-12Method for forming dual-deck channel hole structure of three-dimensional memory device
#56 | 2019-10-31Built-in motor for bicycle and electric powered bicycle
#57 | 2019-10-24Method for forming channel hole plug of three-dimensional memory device
#58 | 2019-10-24Memory device and forming method thereof
#59 | 2019-08-08Three-dimensional memory devices having a plurality of NAND strings
#60 | 2019-08-08Three-dimensional memory devices having a plurality of NAND strings
#61 | 2019-05-30Source structure of three-dimensional memory device and method for forming the same
#62 | 2019-05-30TORQUE SENSOR SYSTEM, TORQUE SIGNAL MEASURING METHOD, ELECTRIC POWER-ASSISTED BICYCLE
#63 | 2019-05-09Three-dimensional memory devices and fabricating methods thereof
#64 | 2019-03-28Memory cell structure of a three-dimensional memory device
#65 | 2019-03-28Word line contact structure for three-dimensional memory devices and fabrication methods thereof
#66 | 2019-03-21Three-dimensional memory devices having a plurality of NAND strings
#67 | 2019-03-14Staircase structure for memory device
#68 | 2019-03-14Three-dimensional memory devices and methods for forming the same
#69 | 2019-03-07Three-dimensional memory devices and fabricating methods thereof
#70 | 2019-02-28Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#71 | 2019-02-28Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#72 | 2019-02-28Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#73 | 2019-02-21Hybrid bonding contact structure of three-dimensional memory device
#74 | 2018-06-14Mueller-matrix microscope and measurement and calibration methods using the same
2214806 ⎘