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Inventor profile of:

Eef Boschman

City:

Aerdt

Country:

Netherlands

Published Applications:

1

Last publication date:

2018-06-14

Top Assignees for applications by Eef Boschman

The entities that hold a legal rights for patent applications filed by inventor Boschman Eef:

ALPHA ASSEMBLY SOLUTIONS INC. 1 South Plainfield, NJ United States
Advanced Packaging Center BV 1 Duiven, Netherlands

Recent patent applications by Boschman Eef

Eef Boschman from Aerdt, NL has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-06-14

US20180166415A1

Method for die and clip attachment

InventorID:

2216361 ⎘