Daisuke WATANABE

City:

Kanagawa

Country:

Japan

Published Applications:

Last publication date:

2025-06-19

Top Assignees for applications by Daisuke WATANABE

The entities that hold a legal rights for patent applications filed by inventor WATANABE Daisuke:

Sony Corporation 4 Tokyo, Japan
SONY MOBILE COMMUNICATIONS INC. 4 Tokyo, Japan
The Yokohama Rubber Co., LTD. 2 Tokyo, Japan
NISSAN MOTOR CO., LTD. 2 Yokohama-shi, Japan
NISSAN MOTOR CO., LTD. 2 Yokohama-shi, Kanagawa, Japan
KELK LTD. 1 Kanagawa, Japan
LENOVO (SINGAPORE) PTE. LTD. 1 Singapore, Singapore

Recent patent applications by WATANABE Daisuke

Daisuke WATANABE from Kanagawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-06-19

US20250199527A1

Physics

INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM

#2 | 2024-06-06

US20240184288A1

Physics

Information processing device, information processing method, and program class

#3 | 2023-06-29

US20230205323A1

Physics

Information processing apparatus and controlling method

#4 | 2022-10-13

US20220326707A1

Physics

Information processing device, information processing method, and program

#5 | 2022-05-05

US20220134696A1

Performing operations; transporting

METHOD OF MANUFACTURING PNEUMATIC TIRE

#6 | 2021-06-10

US20210170801A1

Performing operations; transporting

Pneumatic tire

#7 | 2021-04-15

US20210112628A1

Electricity

Fluid heating device

#8 | 2020-12-31

US20200409365A1

Physics

Information processing device, information processing method, and program

#9 | 2018-09-06

US20180252156A1

Mechanical engineering

Bolt fastening method for lower link

#10 | 2018-06-21

US20180171839A1

Mechanical engineering

Lubrication structure and lubrication method for upper pin in piston crank mechanism of internal combustion engine

InventorID:

2220918 ⎘