Simon Yang

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2022-10-06

Top Assignees for applications by Simon Yang

The entities that hold a legal rights for patent applications filed by inventor Yang Simon:

Simon Yang from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Biodegradable And Compostable Polymers For Rigid Packaging And Processes For Preparing Same

Strained-induced mobility enhancement nano-device structure and integrated process architecture for CMOS technologies

STRAINED-INDUCED MOBILITY ENHANCEMENT NANO-DEVICE STRUCTURE AND INTEGRATED PROCESS ARCHITECTURE FOR CMOS TECHNOLOGIES

Strained-induced mobility enhancement nano-device structure and integrated process architecture for CMOS technologies

InventorID:

223237 ⎘