Suguru HASHIDATE

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-02-15

Top Assignees for applications by Suguru HASHIDATE

The entities that hold a legal rights for patent applications filed by inventor HASHIDATE Suguru:

OSAKA SODA CO., LTD. 1 Osaka, Japan
THE SCHOOL CORPORATION KANSAI UNIVERSITY 1 Suita, Japan

Recent patent applications by HASHIDATE Suguru

Suguru HASHIDATE from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-15

US20240052213A1

Chemistry; metallurgy

ELECTRICALLY CONDUCTIVE ADHESIVE, SINTERED BODY OF ELECTRICALLY CONDUCTIVE ADHESIVE, METHOD FOR PRODUCING SINTERED BODY, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

#2 | 2019-10-17

US20190315901A1

Chemistry; metallurgy

UNSATURATED POLYESTER RESIN COMPOSITION

#3 | 2018-07-05

US20180186064A1

Performing operations; transporting

COMPOSITION FOR LINING

InventorID:

2232760 ⎘