Oh-jung Kwon

City:

Country:

United States

Published Applications:

Last publication date:

2018-06-07

Top Assignees for applications by Oh-jung Kwon

The entities that hold a legal rights for patent applications filed by inventor Kwon Oh-jung:

Oh-jung Kwon from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

HEAT DISSIPATION APPARATUS FOR SEMICONDUCTOR MODULE

Structure and method for forming isolation and buried plate for trench capacitor

InventorID:

22394 ⎘