Munich
Germany
19
2025-03-06
The entities that hold a legal rights for patent applications filed by inventor Meier Sebastian:
Sebastian Meier from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METAL-LINED PACKAGE CAVITY FOR FLUID SENSORS
#2 | 2024-07-04ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
#3 | 2024-04-18O-RING SEALS FOR FLUID SENSING
#4 | 2023-06-22FLUIDIC WAFER PROBE
#5 | 2023-06-15SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
#6 | 2022-12-01THROUGH TRENCH ISOLATION FOR DIE
#7 | 2022-03-03ISFET Biosensor
#8 | 2021-12-02PH sensor
#9 | 2021-10-07Etching platinum-containing thin film using protective cap layer
#10 | 2021-08-05Patterning platinum by alloying and etching platinum alloy
#11 | 2021-01-21O-ring seals for fluid sensing
#12 | 2020-10-20Acoustic detection of laser failure mode in semiconductor environment
#13 | 2020-09-24Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#14 | 2020-06-11Manufacturing fluid sensing packages
#15 | 2020-03-12Etching platinum-containing thin film using protective cap layer
#16 | 2020-01-30Patterning platinum by alloying and etching platinum alloy
#17 | 2019-10-03Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#18 | 2018-07-19Sacrificial layer for platinum patterning
#19 | 2018-07-19Etching platinum-containing thin film using protective cap layer
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