Stefan PFEFFERLEIN

ASSEMBLY HAVING AT LEAST ONE PASSIVE COMPONENT

Sintered Power Electronic Module

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE HAVING AT LEAST ONE SEMICONDUCTOR ARRANGEMENT AND A HEATSINK

Power Electronics Assembly Comprising Power Modules That Can Be Fitted with Components

CIRCUIT ASSEMBLY WITH TWO CIRCUIT CARRIERS AND A SEMICONDUCTOR COMPONENT

ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE

POWER MODULE, ELECTRICAL DEVICE AND METHOD FOR PRODUCING A POWER MODULE

SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT

SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT

HOUSING AND ELECTRICAL APPLIANCE

Electronic circuit, power converter, and method for producing an electronic circuit

Cooling device with fiber attachment between heating tube and cooling element

Circuit carrier, package, and method for manufacturing a package

Circuit carrier, package, and method for manufacturing a package

Semiconductor assembly and method of producing the semiconductor assembly

Semiconductor assembly

Power module having at least one power semiconductor

Cooling apparatus

Electrical converter

Method for producing an electric circuit comprising a circuit carrier, contact areas, and an insulating body

Semiconductor module with a supporting structure on the bottom side

Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assembly

Electrical circuit arrangement having a capacitor with a housing function

Circuit board with implanted optical current sensor