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Inventor profile of:

Ryan Lee Uttech

City:

Schaumburg, Illinois

Country:

United States

Published Applications:

1

Last publication date:

2018-08-09

Recent patent applications by Uttech Ryan Lee

Ryan Lee Uttech from Schaumburg, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-08-09

US20180225408A1

SYSTEM AND METHOD FOR INTERACTIVE MODELING AND ANALYSIS OF 3-D DIGITAL ASSEMBLIES

InventorID:

2265237 ⎘