Eagle, Idaho
United States
4
2023-01-19
The entities that hold a legal rights for patent applications filed by inventor Bolken Todd O.:
Todd O. Bolken from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#2 | 2020-07-30Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#3 | 2018-08-09Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#4 | 2009-08-20Imager wafer level module and method of fabrication and use
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