Hsinchu
Taiwan
68
2024-08-29
The entities that hold a legal rights for patent applications filed by inventor Chen Chih-Ming:
Chih-Ming Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
PIEZOELECTRIC DEVICE WITH HYDROGEN GETTER
#2 | 2024-06-20IN-SITU CAP FOR GERMANIUM PHOTODETECTOR
#3 | 2024-05-09SEMICONDUCTOR DEVICE WITH WAVEGUIDE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#4 | 2024-03-14PIEZOELECTRIC DEVICE AND METHOD OF FORMING THE SAME
#5 | 2024-01-18SEMICONDUCTOR TOOL HAVING CONTROLLABLE AMBIENT ENVIRONMENT PROCESSING ZONES
#6 | 2023-11-16Dielectric sidewall structure for quality improvement in Ge and SiGe devices
#7 | 2023-11-09PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
#8 | 2023-09-07PASSIVE CAP FOR GERMANIUM-CONTAINING LAYER
#9 | 2023-03-16Piezoelectric device and method of forming the same
#10 | 2023-02-02Barrier layer on a piezoelectric-device pad
#11 | 2022-10-27Voltage breakdown uniformity in piezoelectric structure for piezoelectric devices
#12 | 2022-10-20Piezoelectric device with hydrogen getter
#13 | 2022-09-29SELF-ALIGNED DIELECTRIC LINER STRUCTURE FOR PROTECTION IN MEMS COMB ACTUATOR
#14 | 2022-05-05METHOD OF OPTIMIZING FILM DEPOSITION PROCESS IN SEMICONDUCTOR FABRICATION BY USING GAS SENSOR
#15 | 2022-04-28In-situ cap for germanium photodetector
#16 | 2022-01-20Packaging method and associated packaging structure
#17 | 2021-11-04Semiconductor device and fabrication method thereof
#18 | 2021-09-16Semiconductor tool having controllable ambient environment processing zones
#19 | 2021-08-12Method of optimizing film deposition process in semiconductor fabrication by using gas sensor
#20 | 2021-06-03Dielectric sidewall structure for quality improvement in Ge and SiGe devices
#21 | 2021-04-29Piezoelectric device and method of forming the same
#22 | 2021-03-04Self-aligned dielectric liner structure for protection in MEMS comb actuator
#23 | 2020-04-30Semiconductor tool having controllable ambient environment processing zones
#24 | 2020-01-23Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method
#25 | 2020-01-16Piezoelectric device with hydrogen getter
#26 | 2019-08-22Semiconductor device and fabrication method thereof
#27 | 2019-08-08Integrated circuit with backside structures to reduce substrate warp
#28 | 2019-04-04Packaging method and associated packaging structure
#29 | 2019-01-31Dielectric sidewall structure for quality improvement in GE and SIGE devices
#30 | 2018-08-16Bond rings in semiconductor devices and methods of forming same
#31 | 2018-03-29Dielectric sidewall structure for quality improvement in Ge and SiGe devices
#32 | 2017-12-21Semiconductor device and fabrication method thereof
#33 | 2017-09-05Semiconductor device and fabrication method thereof
#34 | 2017-08-24Integrated circuit with backside structures to reduce substrate warp
#35 | 2017-08-10Packaging method and associated packaging structure
#36 | 2017-07-06Silicon nano-tip thin film for flash memory cells
#37 | 2016-07-14Silicon nano-tip thin film for flash memory cells
#38 | 2016-06-30e-Flash Si dot nitrogen passivation for trap reduction
#39 | 2016-04-28Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method
#40 | 2016-03-24E-flash cell band engineering for erasing speed enhancement
#41 | 2016-02-04Integrated circuit with backside structures to reduce substrate warp
#42 | 2015-12-24Well controlled conductive dot size in flash memory
#43 | 2015-10-29Uniformity control for Si dot size in flash memory
#44 | 2015-10-08Silicon dot formation by self-assembly method and selective silicon growth for flash memory
#45 | 2015-07-02Systems and methods of local focus error compensation for semiconductor processes
#46 | 2015-05-14Method of forming semiconductor structure of control gate, and semiconductor device
#47 | 2015-03-12Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method
#48 | 2015-03-12Resistive random access memory and manufacturing method thereof
#49 | 2015-02-26Silicon dot formation by direct self-assembly method for flash memory
#50 | 2015-02-26Silicon dot formation by self-assembly method and selective silicon growth for flash memory
#51 | 2014-12-25Deep trench capacitor
#52 | 2014-12-25Integrated circuit with backside structures to reduce substrate warp
#53 | 2014-05-08Systems and methods of local focus error compensation for semiconductor processes
#54 | 2013-03-28Structure and method for a MRAM device with an oxygen absorbing cap layer
#55 | 2013-03-28Method and structure for a MRAM device with a bilayer passivation
#56 | 2013-03-28Technique for smoothing an interface between layers of a semiconductor device
#57 | 2009-10-22Package-base structure of luminescent diode
#58 | 2008-06-05Broadband circularly polarization antenna device
#59 | 2008-04-17Antenna apparatus
#60 | 2008-03-13Chip antenna module
#61 | 2008-02-28Column antenna apparatus and method for manufacturing the same
#62 | 2008-02-14PACKAGE-BASE STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS OF THE SAME
#63 | 2008-01-10Frequency adjustable antenna apparatus and a manufacturing method thereof
#64 | 2008-01-10Flexible antenna apparatus and a manufacturing method thereof
#65 | 2007-10-25Package base structure and associated manufacturing method
#66 | 2007-05-31Column antenna apparatus and a manufacturing method thereof
#67 | 2007-02-15Flexible antenna apparatus and a manufacturing method thereof
#68 | 2005-02-15Fabrication method of a flash memory device
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