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Inventor profile of:

Bruno Imbert

City:

Grenoble

Country:

France

Published Applications:

Last publication date:

2018-12-13

Top Assignees for applications by Bruno Imbert

The entities that hold a legal rights for patent applications filed by inventor Imbert Bruno:

Commissariat A L'Energie Atomique Et Aux Energies Alternatives 15 Paris, France
COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES 3 Paris, France
SOITEC 3 Bernin, France
COMMISSARIA A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES 1 Paris, France
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT 1 Paris, France
SOITEC 1 Bermin, France
Commissariat al'Energie Atomique et aux Energies Alternatives 1 Paris, France
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES 1 Paris, France

Recent patent applications by Imbert Bruno

Bruno Imbert from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-12-13

US20180355139A1

Chemistry; metallurgy

Method for producing an aqueous foam

#2 | 2018-11-15

US20180330950A1

Electricity

Method for assembling substrates by bonding indium phosphate surfaces

#3 | 2018-10-18

US20180297143A1

Performing operations; transporting

Method for adhering a first structure and a second structure

#4 | 2018-08-02

US20180218999A1

Electricity

Direct bonding method

#5 | 2018-05-31

US20180151436A1

Electricity

Direct bonding method

#6 | 2018-01-18

US20180019124A1

Electricity

Metal-metal direct bonding method

#7 | 2017-08-17

US20170236800A1

Electricity

Method for direct adhesion via low-roughness metal layers

#8 | 2017-07-27

US20170213807A1

Electricity

TUNGSTEN LAYER PASSIVATION PROCESS AND DIRECT BONDING PROCESS

#9 | 2017-05-11

US20170133347A1

Electricity

Method for direct bonding of III-V semiconductor substrates with a radical oxide layer

#10 | 2017-01-26

US20170025377A1

Electricity

Process for producing a structure by assembling at least two elements by direct adhesive bonding

#11 | 2016-06-30

US20160189995A1

Electricity

Process for manufacturing a semiconductor structure with temporary bonding via metal layers

#12 | 2016-05-05

US20160126215A1

Electricity

Method for assembling two substrates of different natures via a ductile intermediate layer

#13 | 2015-12-31

US20150380383A1

Electricity

Method for carrying out a conductive direct metal bonding

#14 | 2015-12-17

US20150364442A1

Electricity

Method for obtaining a bonding surface for direct bonding

#15 | 2013-05-09

US20130111719A1

Electricity

Method for implanting a piezoelectric material

#16 | 2012-06-14

US20120145667A1

Electricity

Process for fabricating an acoustic wave resonator comprising a suspended membrane

InventorID:

228194 ⎘