Addison, Texas
United States
17
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor Revier Daniel Lee:
Daniel Lee Revier from Addison, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
#2 | 2021-05-27Lens cleaning via electrowetting
#3 | 2021-05-20Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
#4 | 2020-12-31Methods and apparatus for surface wetting control
#5 | 2020-05-07Integrated circuit using photonic bandgap structure
#6 | 2019-05-02Galvanic signal path isolation in an encapsulated package using a photonic structure
#7 | 2019-05-02Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
#8 | 2019-05-02Integrated circuit with dielectric waveguide connector using photonic bandgap structure
#9 | 2019-05-02Spectrometry in integrated circuit using a photonic bandgap structure
#10 | 2019-04-25Acoustic management in integrated circuit using phononic bandgap structure
#11 | 2019-04-25Thermal management in integrated circuit using phononic bandgap structure
#12 | 2019-03-07Self-assembly of semiconductor die onto a leadframe using magnetic fields
#13 | 2019-02-28Integrated circuit package with stress directing material
#14 | 2018-11-15Lens cleaning via electrowetting
#15 | 2018-10-25Methods and apparatus for surface wetting control
#16 | 2018-10-25Methods and apparatus for electrostatic control of expelled material for lens cleaners
#17 | 2018-09-06Methods and apparatus providing a graded package for a semiconductor
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