Kensuke Ide

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2017-12-14

Top Assignees for applications by Kensuke Ide

The entities that hold a legal rights for patent applications filed by inventor Ide Kensuke:

MITSUBISHI HEAVY INDUSTRIES, LTD. 6 Tokyo, Japan
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD. 2 Ritto-shi, Shiga, Japan
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD. 2 Shiga, Japan
National Institute of Advanced Industrial Science and Technology 1 Tokyo, Japan
MITSUBISHI HEAVY INDUSTIRIES, LTD. 1 Tokyo, Japan
Mitsubishi Heavy Industries Machine Tool Co., Ltd. 1 Tokyo, Japan

Recent patent applications by Ide Kensuke

Kensuke Ide from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-12-14

US20170355040A1

Performing operations; transporting

Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor device

#2 | 2017-06-08

US20170162428A1

Electricity

ROOM-TEMPERATURE BONDING APPARATUS

#3 | 2015-10-15

US20150294900A1

Electricity

ROOM-TEMPERATURE BONDED DEVICE, WAFER HAVING ROOM-TEMPERATURE BONDED DEVICE, AND ROOM-TEMPERATURE BONDING METHOD

#4 | 2015-09-10

US20150251904A1

Performing operations; transporting

Room temperature bonding apparatus and room temperature bonding method

#5 | 2015-09-03

US20150249026A1

Electricity

ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD

#6 | 2014-08-14

US20140224405A1

Electricity

Room-temperature bonding apparatus

#7 | 2013-05-09

US20130112334A1

Performing operations; transporting

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD

#8 | 2012-10-04

US20120247645A1

Electricity

BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

#9 | 2012-02-09

US20120031557A1

Electricity

Bonding unit control unit and multi-layer bonding method

InventorID:

229385 ⎘