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Inventor profile of:

Jun Rok OH

City:

Seoul

Country:

South Korea

Published Applications:

33

Last publication date:

2022-12-22

Top Assignees for applications by Jun Rok OH

The entities that hold a legal rights for patent applications filed by inventor OH Jun Rok:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 9 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 4 Gyunggi-do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 4 Gyeonggi-do, South Korea
SKC solmics Co., Ltd. 3 Pyeongtaek-si, South Korea
Samsung Electro-Mechanics Co., Ltd. 2 Kyunggi-do, South Korea
SKC CO., LTD 2 Suwon-si, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon-si, South Korea
SKC Co., Ltd. 1 Gyeonggi-do, South Korea
SKC CO., LTD 1 Suwon-si, Gyeonggi-do, South Korea
Solmics Co., Ltd. 1 Pyeongtaek-si, South Korea

Recent patent applications by OH Jun Rok

Jun Rok OH from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-12-22

US20220406574A1

MANUFACTURING METHOD OF RING-SHAPED ELEMENT FOR ETCHER

#2 | 2020-07-16

US20200223700A1

Chemistry; metallurgy

Graphite sheet and method for manufacturing same

#3 | 2020-02-27

US20200062654A1

Chemistry; metallurgy

BORON CARBIDE SINTERED BODY AND ETCHER INCLUDING THE SAME

#4 | 2020-02-13

US20200051793A1

RING-SHAPED ELEMENT FOR ETCHER AND METHOD FOR ETCHING SUBSTRATE USING THE SAME

#5 | 2019-09-12

US20190276778A1

Chemistry; metallurgy

COMPOSITION FOR SEMICONDUCTOR PROCESS AND SEMICONDUCTOR PROCESS

#6 | 2019-09-12

US20190276740A1

Chemistry; metallurgy

Composition for semiconductor process and semiconductor process

#7 | 2018-09-20

US20180265362A1

Chemistry; metallurgy

Graphite sheet and method for manufacturing same

#8 | 2011-07-14

US20110172357A1

COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING THE SAME

#9 | 2011-05-26

US20110121233A1

Chemistry; metallurgy

Composition for forming substrate, and prepreg and substrate using the same

#10 | 2010-11-11

US20100283004A1

Composition for forming substrate, and prepreg and substrate using the same

#11 | 2010-10-28

US20100270065A1

Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same

#12 | 2010-10-28

US20100270064A1

Chemistry; metallurgy

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME

#13 | 2010-10-07

US20100255742A1

Heat Radiation Substrate and Illumination Module Substrate Having Hybrid Layer

#14 | 2010-08-19

US20100210803A1

Chemistry; metallurgy

NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES AND INSULATING MATERIAL USING THE SAME

#15 | 2010-04-01

US20100077582A1

Method of manufacturing chip capacitor including ceramic/polymer composite

#16 | 2010-03-11

US20100063226A1

Chemistry; metallurgy

NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES, AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTION ELEMENT USING THE SAME

#17 | 2010-02-25

US20100048858A1

Chemistry; metallurgy

Poly(-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the same

#18 | 2009-11-26

US20090288863A1

GLASS COMPOSITION WITH LOW COEFFICIENT OF THERMAL EXPANSION, GLASS FIBER, INSULATING LAYER OF PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

#19 | 2009-10-22

US20090262520A1

Backlight unit using a thermoplastic resin board

#20 | 2009-07-30

US20090189177A1

Light emitting diode package and manufacturing method thereof

#21 | 2009-07-02

US20090168449A1

Mechanical engineering

Light emitting diode unit

#22 | 2009-06-04

US20090141481A1

Array light source using led and backlight unit including the same

#23 | 2009-05-21

US20090128174A1

Probe card using thermoplastic resin

#24 | 2009-04-30

US20090106977A1

Manufacturing method of printed circuit board

#25 | 2009-03-19

US20090072207A1

FLAME RETARDANT RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF

#26 | 2008-10-02

US20080242787A1

Chemistry; metallurgy

Eucryptite ceramic filler and insulating composite material containing the same

#27 | 2008-09-18

US20080223603A1

Capacitor embedded printed circuit board

#28 | 2008-04-03

US20080081177A1

Insulating material for printed circuit board

#29 | 2007-10-18

US20070240303A1

Method of manufacturing printed circuit board including embedded capacitors

#30 | 2007-06-07

US20070125574A1

PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME

#31 | 2006-11-02

US20060246284A1

Fabric reinforcement using modified cyclic olefin copolymer and resin substrate for printed circuit board

#32 | 2006-11-02

US20060243479A1

Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same

#33 | 2006-02-16

US20060032666A1

Printed circuit board including embedded capacitors and method of manufacturing the same

InventorID:

2297640 ⎘