Hsinchu
Taiwan
9
2025-06-05
The entities that hold a legal rights for patent applications filed by inventor LEE Hui:
Hui LEE from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF FABRICATING A SEMICONDUCTOR CHIP
#2 | 2024-11-28SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
#3 | 2024-11-14Nitrogen Plasma Treatment For Improving Interface Between Etch Stop Layer And Copper Interconnect
#4 | 2023-11-16Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer
#5 | 2023-04-20Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect
#6 | 2022-09-29Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer
#7 | 2022-09-29Semiconductor devices and methods of manufacture
#8 | 2021-08-19Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect
#9 | 2018-09-20Semiconductor device, layout pattern and method for manufacturing an integrated circuit
2300860 ⎘