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Inventor profile of:

Alex L. CHAN

City:

Ottawa

Country:

Canada

Published Applications:

Last publication date:

2019-03-21

Top Assignees for applications by Alex L. CHAN

The entities that hold a legal rights for patent applications filed by inventor CHAN Alex L.:

Alcatel-Lucent Canada, Inc. 5 Ottawa, Canada
Alcatel Lucent 3 BOULOGNE BILLANCOURT, France
ALCATEL LUCENT 2 Paris, France
Nokia Solutions and Networks Oy 1 Espoo, Finland
ALCATEL LUCENT 1 Boulogne-Biilancourt, France

Recent patent applications by CHAN Alex L.

Alex L. CHAN from Ottawa, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-03-21

US20190087524A1

Physics

Spatial location of vias in a printed circuit board

#2 | 2018-06-14

US20180165401A1

Physics

NON-ORTHOGONAL ROUTING ON A PRINTED CIRCUIT BOARD

#3 | 2018-04-05

US20180098447A1

Electricity

Side clamping BGA socket

#4 | 2018-03-22

US20180082868A1

Electricity

GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY

#5 | 2018-01-18

US20180020547A1

Electricity

UNDERLYING RECESSED COMPONENT PLACEMENT

#6 | 2017-11-28

US15140146

Electricity

Side clamping BGA socket

#7 | 2016-05-12

US20160135288A1

Electricity

Backdrill reliability anchors

#8 | 2013-05-09

US20130113067A1

Electricity

Thermal warp compensation IC package

#9 | 2012-04-05

US20120081872A1

Electricity

THERMAL WARP COMPENSATION IC PACKAGE

#10 | 2012-04-05

US20120081871A1

Electricity

Warp reactive IC package

#11 | 2011-09-29

US20110235304A1

Electricity

IC PACKAGE STIFFENER WITH BEAM

#12 | 2011-09-29

US20110235283A1

Electricity

Removable IC package stiffening brace and method

InventorID:

230711 ⎘