Rolla, Missouri
United States
8
2019-06-27
The entities that hold a legal rights for patent applications filed by inventor Bai Dongshun:
Dongshun Bai from Rolla, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Laser-releasable bonding materials for 3-D IC applications
#2 | 2017-02-09Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
#3 | 2016-01-28Polyimides as laser release materials for 3-D IC applications
#4 | 2015-07-09Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
#5 | 2013-05-09Self-leveling planarization materials for microelectronic topography
#6 | 2012-11-22Cyclic olefin compositions for temporary wafer bonding
#7 | 2011-04-14Cyclic olefin compositions for temporary wafer bonding
#8 | 2010-05-06Cyclic olefin compositions for temporary wafer bonding
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