Tokyo
Japan
42
2021-10-21
The entities that hold a legal rights for patent applications filed by inventor ISA Satoshi:
Satoshi ISA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices
#2 | 2021-03-04Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses
#3 | 2019-10-03Apparatuses comprising semiconductor dies in face-to-face arrangements
#4 | 2016-01-28Semiconductor device
#5 | 2015-11-05SEMICONDUCTOR DEVICE
#6 | 2015-09-17Semiconductor device
#7 | 2014-04-03Semiconductor device
#8 | 2014-02-06Semiconductor device stack with bonding layer and wire retaining member
#9 | 2013-05-09SEMICONDUCTOR DEVICE
#10 | 2012-06-14SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#11 | 2011-12-01Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate
#12 | 2011-07-28Semiconductor device
#13 | 2011-04-14Semiconductor package substrate and semiconductor device having the same
#14 | 2011-03-17Semiconductor device including plural electrode pads
#15 | 2010-12-16Semiconductor device that suppresses malfunctions due to noise generated in internal circuit
#16 | 2010-11-18Semiconductor device
#17 | 2010-08-26Semiconductor device having wiring layers with power-supply plane and ground plane
#18 | 2010-08-19Semiconductor device with additional power supply paths
#19 | 2010-08-05Semiconductor device stack with bonding layer and wire retaining member
#20 | 2010-08-05SEMICONDUCTOR DEVICE
#21 | 2010-04-15ELECTROMAGNETIC FIELD ANALYSIS OF SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIP MOUNTED THEREON
#22 | 2009-10-08Semiconductor device
#23 | 2009-06-04Semiconductor device
#24 | 2009-02-05Semiconductor stack package having wiring extension part which has hole for wiring
#25 | 2008-09-18Semiconductor device
#26 | 2008-07-24Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes
#27 | 2008-07-10Semiconductor device
#28 | 2008-03-20Method for designing device, system for aiding to design device, and computer program product therefor
#29 | 2008-01-17Semiconductor device
#30 | 2007-11-29Semiconductor package with bypass capacitor
#31 | 2007-08-30Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor
#32 | 2007-07-19SEMICONDUCTOR DEVICE
#33 | 2007-07-03Semiconductor apparatus capable of preventing occurrence of multiple reflection, driving method, and setting method thereof
#34 | 2007-04-19Semiconductor device
#35 | 2007-04-05Semiconductor device including semiconductor chip with two pad rows
#36 | 2007-03-29Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same
#37 | 2007-03-15Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package
#38 | 2007-02-08Inductance analysis system and method and program therefor
#39 | 2007-01-04Stacked semiconductor package
#40 | 2006-11-09Semiconductor device
#41 | 2005-12-20Semiconductor memory device capable of improving quality of voltage waveform given in a signal interconnection layer
#42 | 2005-04-28Memory system and memory module
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