Beaverton, Oregon
United States
44
2026-04-09
The entities that hold a legal rights for patent applications filed by inventor Agarwal Pulkit:
Pulkit Agarwal from Beaverton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
INHIBITED OXIDE DEPOSITION FOR REFILLING SHALLOW TRENCH ISOLATION
#2 | 2026-03-19LAYERED METAL OXIDE-SILICON OXIDE FILMS
#3 | 2026-02-26PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS
#4 | 2025-11-06NONCONFORMAL OXIDE FILM DEPOSITION USING CARBON-CONTAINING INHIBITOR
#5 | 2025-09-04RAPID TUNING OF CRITICAL DIMENSION NON-UNIFORMITY BY MODULATING TEMPERATURE TRANSIENTS OF MULTI-ZONE SUBSTRATE SUPPORTS
#6 | 2025-08-21DYNAMIC PROCESS CONTROL IN SEMICONDUCTOR MANUFACTURING
#7 | 2025-06-05SURFACE INHIBITION ATOMIC LAYER DEPOSITION
#8 | 2025-05-29TEMPERATURE CONTROL OF A MULTI-ZONE PEDESTAL
#9 | 2025-05-22THERMAL FILM DEPOSITION
#10 | 2025-04-17SUBSTRATE PROCESSING APARATUSES WITH ROTATING MECHANISMS INCLUDING SHAFTS WITH GAS FLOW PATHS
#11 | 2025-03-13INCREASING DEPOSITION RATES OF OXIDE FILMS
#12 | 2024-11-28APPARATUS FOR CLEANING PLASMA CHAMBERS
#13 | 2024-11-28TRIM AND DEPOSITION PROFILE CONTROL WITH MULTI-ZONE HEATED SUBSTRATE SUPPORT FOR MULTI-PATTERNING PROCESSES
#14 | 2024-10-24IN-SITU CORE PROTECTION IN MULTI-PATTERNING
#15 | 2024-10-03MODULATED ATOMIC LAYER DEPOSITION
#16 | 2024-10-03PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS
#17 | 2024-06-06METHOD AND APPARATUS FOR MODULATING FILM UNIFORMITY
#18 | 2023-06-08SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL
#19 | 2023-06-01AUTOMATED FEEDFORWARD AND FEEDBACK SEQUENCE FOR PATTERNING CD CONTROL
#20 | 2022-09-29Use of vacuum during transfer of substrates
#21 | 2022-09-15Dynamic process control in semiconductor manufacturing
#22 | 2022-08-04Temperature control of a multi-zone pedestal
#23 | 2022-08-04USE OF ROTATION TO CORRECT FOR AZIMUTHAL NON-UNIFORMITIES IN SEMICONDUCTOR SUBSTRATE PROCESSING
#24 | 2022-07-14Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supports
#25 | 2022-06-30Modulated atomic layer deposition
#26 | 2022-06-30Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes
#27 | 2022-06-09Apparatus for cleaning plasma chambers
#28 | 2021-07-01Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film
#29 | 2020-12-31Method and apparatus for providing station to station uniformity
#30 | 2020-11-05Controller for controlling core critical dimension variation using flash trim sequence
#31 | 2020-03-05Method and apparatus for providing station to station uniformity
#32 | 2020-02-27Method and apparatus for modulating film uniformity
#33 | 2020-02-06Compensating chamber and process effects to improve critical dimension variation for trim process
#34 | 2020-01-30Method for controlling core critical dimension variation using flash trim sequence
#35 | 2020-01-02Azimuthal critical dimension non-uniformity for double patterning process
#36 | 2019-11-14METHOD OF PROVIDING A PLASMA ATOMIC LAYER DEPOSITION
#37 | 2019-07-04Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer
#38 | 2019-05-30Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film
#39 | 2019-05-23Multi zone substrate support for ALD film property correction and tunability
#40 | 2019-03-14Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer
#41 | 2018-12-27Methods and apparatuses for increasing reactor processing batch size
#42 | 2018-11-01Atomic layer clean for removal of photoresist patterning scum
#43 | 2018-10-25Atomic layer etch, reactive precursors and energetic sources for patterning applications
#44 | 2018-06-12Atomic layer etch methods and hardware for patterning applications
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