Reno, Nevada
United States
8
2021-05-20
The entities that hold a legal rights for patent applications filed by inventor Smith Wayne C.:
Wayne C. Smith from Reno, US has applied for patents for these inventions. The list has both pending applications and granted patents:
System and method for cleaning wire bonding machines using functionalized surface microfeatures
#2 | 2021-01-07PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
#3 | 2021-01-07PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
#4 | 2021-01-07Pick and place machine cleaning system and method
#5 | 2021-01-07PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
#6 | 2020-10-06Pick and place machine cleaning system and method
#7 | 2018-10-25Semiconductor wire bonding machine cleaning device and method
#8 | 2017-11-21Semiconductor wire bonding machine cleaning device and method
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