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Inventor profile of:

Lei XIA

City:

Beijing

Country:

China

Published Applications:

6

Last publication date:

2026-01-01

Top Assignees for applications by Lei XIA

The entities that hold a legal rights for patent applications filed by inventor XIA Lei:

  • TARGETINGONE TECHNOLOGY (BEIJING) CORPORATION 2 Beijing, China
  • BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD. 1 Beijing, China

Recent patent applications by XIA Lei

Lei XIA from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-01
US20260001071A1
Performing operations; transporting

INTERGRATED MICRO-DROPLET CHIP AND MICRODROPLET MULTI-INDEX DETECTION METHOD THEREFOR

#2 | 2025-01-16
US20250018394A1
Performing operations; transporting

INTEGRATED DROPLET CHIP

#3 | 2023-03-02
US20230061599A1
Physics

POSITIONING METHOD, ELECTRONIC DEVICE AND STORAGE MEDIUM

#4 | 2022-02-03
US20220035045A1
Physics

EPHEMERIS DATA PROCESSING METHOD, ELECTRONIC DEVICE AND STORAGE MEDIUM

#5 | 2022-01-27
US20220023136A1
Human necessities

METHOD FOR GUIDING A BLIND, ELECTRONIC DEVICE, STORAGE MEDIUM, AND BLIND GUIDE PRODUCT

#6 | 2018-11-01
US20180312437A1
Chemistry; metallurgy

POLYURETHANE, MODIFIED ASPHALT AND MIXTURE MATERIAL CONTAINING SAME AND PAVEMENT STRUCTURE

InventorID:

2336100 ⎘

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