Eiji OKUDA

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2019-01-10

Top Assignees for applications by Eiji OKUDA

The entities that hold a legal rights for patent applications filed by inventor OKUDA Eiji:

Eiji OKUDA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

WELAN GUM-CONTAINING COMPOSITION

METHOD FOR IMPROVING OR MAINTAINING PHYSICAL PROPERTIES OF SUBSTANCE

FOOD-IMPROVING AGENT

Glass substrate for data recording medium and manufacturing method thereof

InventorID:

2340314 ⎘