Benjamin Edward Lee Moore

City:

Central, South Carolina

Country:

United States

Published Applications:

Last publication date:

2024-08-08

Top Assignees for applications by Benjamin Edward Lee Moore

The entities that hold a legal rights for patent applications filed by inventor Moore Benjamin Edward Lee:

TFORM, INC. 2 Greenville, SC United States

Recent patent applications by Moore Benjamin Edward Lee

Benjamin Edward Lee Moore from Central, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-08-08

US20240262596A1

Performing operations; transporting

PACKAGING MATERIAL

#2 | 2024-07-25

US20240246326A1

Performing operations; transporting

ALTERNATING STAGGERED LAYER CORE INSULATING PANEL AND METHOD OF MAKING SAME

#3 | 2021-03-04

US20210061535A1

Performing operations; transporting

Packaging material

#4 | 2018-11-22

US20180334308A1

Performing operations; transporting

FULLY RECYCLABLE INSULATED SHIPPING CONTAINER

InventorID:

2354023 ⎘