Osaka
Japan
15
2025-11-20
The entities that hold a legal rights for patent applications filed by inventor Ukei Hiroichi:
Hiroichi Ukei from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
SEALING MEMBER
#2 | 2023-11-09ELECTROMAGNETIC WAVE ABSORBER AND ELECTROMAGNETIC WAVE ABSORBER-ATTACHED MOLDED ARTICLE
#3 | 2021-02-25Electromagnetic wave absorber, article with electromagnetic wave absorber, and method for manufacturing electromagnetic wave absorber
#4 | 2020-07-02Electromagnetic wave absorber and electromagnetic wave absorber-attached molded article
#5 | 2020-07-02Electromagnetic wave absorber and electromagnetic wave absorber-attached molded article
#6 | 2020-06-04Electromagnetic wave absorber
#7 | 2020-05-21Electromagnetic wave absorber and molded article with electromagnetic wave absorber
#8 | 2020-04-23ELECTROMAGNETIC WAVE ABSORBER AND ELECTROMAGNETIC WAVE ABSORBER-ATTACHED MOLDED ARTICLE
#9 | 2020-04-16Lamp reflector and laminate for reflector
#10 | 2019-12-12Electromagnetic wave absorber and molded article with electromagnetic wave absorber
#11 | 2016-10-20Electrically insulating resin composition and laminate sheet
#12 | 2013-08-15POROUS RESIN SHEET AND METHOD FOR PRODUCING THE SAME
#13 | 2013-05-09ELECTRICALLY INSULATING RESIN COMPOSITION AND LAMINATE SHEET
#14 | 2008-01-03Adhesive tape joining apparatus
#15 | 2005-02-03Steel plate reinforcing sheet
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