Tokyo
Japan
5
2019-02-21
The entities that hold a legal rights for patent applications filed by inventor SURUGA Yoichi:
Yoichi SURUGA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
#2 | 2019-02-14Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
#3 | 2019-01-10Ultrasonic bonding jig, bonding structure, and bonding method
#4 | 2018-12-27ULTRASONIC BONDING METHOD, ULTRASONIC BONDING JIG, AND BONDING STRUCTURE
#5 | 2018-11-22Joining structure of thin metal plate and base material, and welding method of thin metal plate and base material
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